Flux Desoldering Braid Solder Remover Pure Copper Absorption Wire

Mobile Phone Motherboard Repair BGA Desoldering wire, absorption wire Soldering Accessory assistant for removing unwanted solder Quickly. Sucking line BGA Desoldering Solder Wire BGA Tin Absorbtion line, Desoldering Wire Solder wick Except for the tin absorbing excess solder. 99.9% pure copper BGA Desoldering wire - Quickly removes unwanted solder when used with a soldering iron. Improve Your mobile phone PCB Desoldering Process. Features: High efficiency and save the electric repairing time. Avoid the high temperature destruction of electric pad. Design in precision,guarantee the max surface tension and the ability of absorbing tin. Speed up the speed of absorbing tin and low residue of flux. Increase the speed of cleaning the PCB pad. Oxidation resistivity and anti-corrosion protection,good thermal conductivity.  Specifications: Length: 1.5M Width: 1.5/2.0/2.5/3.0/3.5mm Material: Pure CopperPackage include: 1pc [ Option BGA Desoldering wire ]:Option 1: SFD-1515(CP) -- 1.5mm Width, 1.5M LenghtOption 2: SFD-2015(CP) -- 2.0mm Width, 1.5M LenghtOption 3: SFD-2515(CP)
Mobile Phone Motherboard Repair BGA Desoldering wire, absorption wire Soldering Accessory assistant for removing unwanted solder Quickly. Sucking line BGA Desoldering Solder Wire BGA Tin Absorbtion line, Desoldering Wire Solder wick Except for the tin absorbing excess solder.99.9% pure copper BGA Desoldering wire - Quickly removes unwanted solder when used with a soldering iron. Improve Your mobile phone PCB Desoldering Process.Features: High efficiency and save the electric repairing time. Avoid the high temperature destruction of electric pad. Design in precision,guarantee the max surface tension and the ability of absorbing tin. Speed up the speed of absorbing tin and low residue of flux. Increase the speed of cleaning the PCB pad. Oxidation resistivity and anti-corrosion protection,good thermal conductivity.  Specifications: Length: 1.5M Width: 1.5/2.0/2.5/3.0/3.5mm Material: Pure CopperPackage include: 1pc [ Option BGA Desoldering wire ]:Option 1: SFD-1515(CP) -- 1.5mm Width, 1.5M LenghtOption 2: SFD-2015(CP) -- 2.0mm Width, 1.5M LenghtOption 3: SFD-2515(CP) --  2.5mm Width, 1.5M LenghtOption 4: SFD-3015(CP) -- 3.0mm Width, 1.5M LenghtOption 5: SFD-3515(CP)-- 3.5mm Width, 1.5M LenghtSucking tin belt is a metal wire braid that utilizes capillary action to absorb molten solder, which is used to remove excess solder, it has good thermal conductivity and excellent ability of absorbing tin, applied to clean the re-soldering point on the motherboard , when use with the soldering station.1 Make with 99.9% pure copper and special chemicals, make sure good, fast and save material during use process.2  Used to remove excess solder during remove tin, high resistant oxidative corrosion, good thermal conductivity, tin absorb, and sucking tin thoroughly.Use:Place the desoldering wick over the solder to be removed, then push the heated soldering iron tip onto the desoldering wick. The solder will be absorbed.Remove the desoldering wick after the solder has been absorbed.Cut off the used section of the wick using nippers
Mobile Phone Motherboard Repair BGA Desoldering wire, absorption wire Soldering Accessory assistant for removing unwanted solder Quickly. Sucking line BGA Desoldering Solder Wire BGA Tin Absorbtion line, Desoldering Wire Solder wick Except for the tin absorbing excess solder. 99.9% pure copper BGA Desoldering wire - Quickly removes unwanted solder when used with a soldering iron. Improve Your mobile phone PCB Desoldering Process. Features: High efficiency and save the electric repairing time. Avoid the high temperature destruction of electric pad. Design in precision,guarantee the max surface tension and the ability of absorbing tin. Speed up the speed of absorbing tin and low residue of flux. Increase the speed of cleaning the PCB pad. Oxidation resistivity and anti-corrosion protection,good thermal conductivity.  Specifications: Length: 1.5M Width: 1.5/2.0/2.5/3.0/3.5mm Material: Pure CopperPackage include: 1pc [ Option BGA Desoldering wire ]:Option 1: SFD-1515(CP) -- 1.5mm Width, 1.5M LenghtOption 2: SFD-2015(CP) -- 2.0mm Width, 1.5M LenghtOption 3: SFD-2515(CP) --  2.5mm Width, 1.5M LenghtOption 4: SFD-3015(CP) -- 3.0mm Width, 1.5M LenghtOption 5: SFD-3515(CP)-- 3.5mm Width, 1.5M Lenght Sucking tin belt is a metal wire braid that utilizes capillary action to absorb molten solder, which is used to remove excess solder, it has good thermal conductivity and excellent ability of absorbing tin, applied to clean the re-soldering point on the motherboard , when use with the soldering station. 1 Make with 99.9% pure copper and special chemicals, make sure good, fast and save material during use process.2  Used to remove excess solder during remove tin, high resistant oxidative corrosion, good thermal conductivity, tin absorb, and sucking tin thoroughly. Use:Place the desoldering wick over the solder to be removed, then push the heated soldering iron tip onto the desoldering wick. The solder will be absorbed.Remove the desoldering wick after the solder has been absorbed.Cut off the used section of the wick using nippers

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