Thermal Release Tape │ Force-One Applied Materials

Thermal Release Tape │ Force-One Applied Materials

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Description

Thermal Release Film(Dicing tape,Valfo Tape) can be released after heating the tape to a specific temperature. So it can be applied on somewhere which you want to protect or fix your products, but need quick to release by heating. It is mainly composed of a layer of adhesive on a substrate. The substrate used is a plastic film, and the adhesive is a pressure-sensitive adhesive which has a reduced peeling force after being heated to a certain temperature, and can be released the components after being heated to a proper temperature after the process is completed. Applied for stacking, cutting, flipping of multilayer ceramic capacitors (MLCC) or other components. Especially in the work that can not be achieved by the UV release tape, it can often be done by thermal Release Tape. We still can customized development according to request.
Thermal Release Film can be released after heating the tape to a specific temperature. So it can be applied on somewhere which you want to protect or fix your products, but need quick to release by heating. The thermal Release Film is a special adhesive tape which is mainly composed of a layer of adhesive on a substrate. The substrate used is a plastic film, and the adhesive is a pressure-sensitive adhesive which has a reduced peeling force after being heated to a certain temperature, and can be released the components after being heated to a proper temperature after the process is completed. Applied for stacking, cutting, flipping of multilayer ceramic capacitors (MLCC) or other components. Especially in the work that can not be achieved by the UV release tape, it can often be done by thermal Release Tape. We still can customized development according to request.

1. After heating, the peeling force of adhesion is very low, and no residue left after removal.

2. The reaction time is fast after heating, which can effectively improves work efficiency.

3. Special adhesive formula, good adhesion, no scattering when cutting.

4. Special structural design to reduce the impact on the life of the cutting knife.

Thermal Release Tape For Hard Substrate NWS-TS322F

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Thermal Release Tape For Hard Substrate NWS-TS322F